RFQ / ECAD

In order to produce a quote, we need the following documents

• IPC 2581 XML: If you have Manufacturer Part Numbers (MPN) and Manufacturer (MFR) names in your e-cad BOM, those columns should be selected when exporting the IPC file.

If you do not have MPN/MFR details in your e-cad sources, we will also need a BOM CSV that includes reference designators (and MPN/MFR) and a Position CSV file as well.

• Bill Of Materials (BOM): Fully formed Manufacturer Part Number and Manufacturer Name must be included for each Reference Designator (or set of Refs)

• Digikey Part Numbers (when available) are helpful, but not required
• LCSC part numbers alone are not as useful, as they’re easy to mix up and often lead to errors.

• X2 Gerbers: Please include all layers, not just the top and bottom. These help us understand copper mass, predict thermal profiles and tune our reflow process.
• Source Files (optional): Please provide ECAD source files for your project if you can. These help us generate more useful inputs for our production process.

PCB

• Maximum (typically) supported PCB dimensions:

• 250mm x 300mm
• Contact us for larger format options and limitations

• Maximum supported component height:

• 25mm

• Ensure you have at least 3 Fiducials as far away from each other as is reasonable

• Include Fiducials in the Position File
• Include additional Fiducials on rails if your boards are panelized

• To help us catch design problems, ensure all footprints have a meaningful Reference Designator (R1, C1, U1, etc.) that is ideally visible on the silk screen

• Reference Designators should generally be oriented in the same direction or at most, 2 directions

• We can handle single or double-sided assemblies. If you’re focused on reducing cost, single-sided is ~30% less work. Once we’re doing a second side, it doesn’t matter so much how components are distributed between both sides (i.e., A single component on side 2 is nearly as costly as 50% components on each side for production).
• Try to avoid Through Hole Technology (THT) whenever possible. These are very difficult to place efficiently. If THT components are required, they generally cost more than twice as much as SMT versions to place and THT prices do not move nearly as much with quantity.

PCB Fabrication

• Always choose ENIG (gold coated pads), not HASL (tin coated pads)

• This is especially important for components <= 0402 or LQFP/QFN ICs

• Please ensure purely Through Hole component apertures are generally not in the solder paste layer / stencil.
• Please ensure mixed components (THT + SMT) like some USB connectors do have their through hole pads included in the stencil.

Stencils

• Please provide a 0.1mm thick framed stencil with electropolish and nanocoating, when available
• OSH Stencil does not offer nanocoating, but we can work with their stencils as long as the design doesn’t have large numbers of very small (0402, QFN, etc.) footprints.

Component Ordering

We prefer to order parts on your behalf. We strongly prefer Digikey as a primary component source. For components that cannot be sourced from Digikey, or where Digikey is not price competitive, we tend to check Mouser, Arrow and direct manufacturers in that order.

We do not charge additional fees for components that we order on your behalf, we simply bill at cost + shipping.

If your components are hard to source, or you want to order excess inventory for future orders, please let us know and we will work with you on finding a solution.

• 0402 or larger, prefer >= 0603 when possible (for now)
• LQFP or LQFN or larger (for now)
• No BGA or WLCSP (for now)
• Prefer Cut Tape > Jedec Tray, Jedec Tray > Tube and Tube > Bulk packaging

• No need for DigiReel or MouseReel: Our proprietary cut tape feeders do not need them
• When available, select Digikey Mini Jedec Tray for small quantity tray packaged components
• Tube & Bulk packaged parts will likely get additional service fees in the future

• While our custom feeders lead the industry in minimizing component waste, they do require 40mm of tape to operate effectively.

• 4mm pitch components (0603, 0805): Min. 10 units on cut tape
• 2mm pitch components (0201, 0402): Min. 20 units on cut tape
• It’s good practice to order a few excess parts for a safety factor.

• Include your Eight Amps Sales Order Number with each set of parts & PCBs.
• For parts you plan to use in the future, feel free to order excess components and we’ll store them for your future orders

• We’ll work out appropriate plans for inventory management and storage durations together.
• We’ll ship any held inventory to you at any time upon request. Shipping will be billed to you based on the level of urgency you request the parts.

• Before ordering from Digikey, please contact their sales team (sales@digikey.com) and request that any cut tape parts you order should be shipped on a single string of cut tape, not separated based on availability.

Process Details

We are currently exercising our material handling tools and workflows. While working through these processes, we are generally hand-placing components on a small-batch, fast-turn basis.

• Solder Paste:

• For Stencils: We use Indium, SAC305 10.1HF, or Locktite/Harimatec GC-10 lead-free solder paste
• For applications that require dispense, rather than stencil, we use Indium, SAC305, 8.9HF, lead-free solder paste
• Other: While we cannot introduce leaded solder in our currently small facility, we’re open to other chemistries, please contact us if you need something specific.

• Reflow: We use Neoden IN6 reflow ovens
• Shipping: One-way, one-time shipping is included with each order. 1-3 day orders include Next-Day Air, 3-5 orders in 2nd-Day Air (up to $100), and 5-10 day orders include Ground shipping (up to $50). If your assembled boards are unusually large or heavy, we may need to add shipping costs to the estimate.

Changelog

Document Updated: 2026-05-19

• Clarified packet instructions
• Changed requested stencil thickness to 0.1mm
• Added Loctite/Harimatec GC-10 solder paste
• Clarified shipping details

Document Updated: 2025-11-10

• Added clarifying note for THT components under the PCB section
• Removed Date from Process Details header

Document Updated: 2025-07-23 (here)